The brand new Koch-Chemie Polishing & Sealing Pad is made from extra-fine finish sponge designed to economically and evenly apply sealing products when working in collaboration with Koch-Chemie P1 Lack-Polish Grn and 1K Nano. The short height of 25mm creates low torsion forces whilst providing the highest level of stability and excellent handling.

The unique density of the foam enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count provides a high level of abrasiveness and increases the lifespan of the pad. The milling edge enables increased flexibility, allowing them to move around contours more easily.

The colourful non-woven material, suitable for polishing, ensures process safety. Colour coordinated to match the rest of the Koch-Chemie polishing system.